Features

 Minimum instruction execution time can be changed from high speed (0.03125  μ s: @ 32 MHz operation with high-

speed on-chip oscillator) to ultra low-speed (30.5  μ s: @ 32.768 kHz operation with subsystem clock)

 General-purpose register: 8 bits × 32 registers (8 bits × 8 registers × 4 banks)

 ROM: 8 to 64 KB, RAM: 0.5 to 4 KB, Data flash memory: 4 KB

 High-speed on-chip oscillator

• Select from 32 MHz (TYP.), 24 MHz (TYP.), 16 MHz (TYP.), 12 MHz (TYP.), 8 MHz (TYP.), 4 MHz (TYP.), and 1

MHz (TYP.)

 On-chip single-power-supply flash memory (with prohibition of block erase/writing function)

 Self-programming (with boot swap function/flash shield window function)

 On-chip debug function

 On-chip power-on-reset (POR) circuit and voltage detector (LVD)

 On-chip watchdog timer (operable with the dedicated internal low-speed on-chip oscillator)

 On-chip multiplier and divider/multiply-accumulator

• 16 bits × 16 bits = 32 bits (Unsigned or signed)

• 32 bits ÷ 32 bits = 32 bits (Unsigned)

• 16 bits × 16 bits + 32 bits = 32 bits (Unsigned or signed)

 On-chip key interrupt function

 On-chip clock output/buzzer output controller

 On-chip BCD adjustment

 I/O ports: 16 to 44 (N-ch open drain: 0 to 4)

 Timer

• 16-bit timer: 8 channels

• Watchdog timer: 1 channel

• Real-time clock:  1 channel

• Interval timer:  1 channel

• Wakeup timer:  1 channel

 Serial interface

• CSI: 0 to 8 channels

• UART/UART (LIN-bus supported): 1 to 5 channels

• I 2 C/Simplified I 2 C communication: 0 to 7 channels

 8/10-bit resolution A/D converter (V DD = 1.8 to 5.5 V): 4 to 12 channels

 Power supply voltage: V DD  = 1.8 to 5.5 V (J version), V DD  = 2.7 to 5.5 V (K version)

 Operating ambient temperature: T A  = −40 to +85°C (J version), T A  = −40 to +125°C (K version)